1-Propanamine, N,N-dimethyl-3-(trimethoxysilyl)- (N,N-二甲基-3-氨丙基）三甲氧基硅烷

CAS 2530-86-1 MFCD00053674

化学结构图

2530-86-1
SMILES: CO[Si](CCCN(C)C)(OC)OC

化学属性

Mol. FormulaC8H21NO3Si
Mol. Weight207.34
Refractive index1.4150 to 1.4190
Boiling Point106 °C at 30 mmHg
Density0.948
Flash Point98.9°C
Melting Point<0 °C

别名和识别编码

Chemical Name[3-(N,N-Dimethylamino)Propyl]Trimethoxysilane
CAS Number2530-86-1
PubChem Substance ID75668
EC Number219-786-3
MDL NumberMFCD00053674
Synonym N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {} {} {} {} {} {LY} N,N-Dimethyl-3-(trimethoxysilyl)propan-1-amine {} {} {} {} {} {} {} {
Chemical Name Translation(N,N-二甲基-3-氨丙基）三甲氧基硅烷
Reaxys-RN2074409
InChIKeyQIOYHIUHPGORLS-UHFFFAOYSA-N
LabNetwork Molecule IDLN00868718
Canonical SMILESCO[Si](OC)(CCCN(C)C)OC
InChIInChI=1S/C8H21NO3Si/c1-9(2)7-6-8-13(10-3,11-4)12-5/h6-8H2,1-5H3
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分类

  • {SNA} Chemical Synthesis, Materials Science, Micro/NanoElectronics, Organometallic Reagents, Organosilicon, Self Assembly & Contact Printing, Self-Assembly Materials, Silanes, Trialkoxysilanes
  • Chemical Synthesis, Materials Science, Micro/NanoElectronics, Organometallic Reagents, Organosilicon, Self Assembly & Contact Printing, Self-Assembly Materials,
  • {SNA} Chemical Synthesis, Micro/NanoElectronics, Organometallic Reagents, Organosilicon, Self Assembly & Contact Printing, Self-Assembly Materials, Silanes, Trialkoxysilanes, 材料科学

安全信息

GHS Symbol
WGK Germany3
Hazard Codes C
Hazard statements
  • H314 Causes severe skin burns and eye damage 导致严重的皮肤灼伤和眼睛损伤
  • H317 May cause an allergic skin reaction 可能导致皮肤过敏
  • H318 Causes serious eye damage 严重伤害眼睛
  • H335 May cause respiratory irritation 可能导致呼吸道刺激
Personal Protective Equipment Faceshields, full-face respirator (US), Gloves, Goggles, multi-purpose combination respirator cartridge (US), type ABEK (EN14387) respirator filter
Precautionary statements
  • P260 Do not breathe dust/fume/gas/mist/vapours/spray. 不要吸入粉尘/烟/气体/烟雾/蒸汽/喷雾。
  • P261 Avoid breathing dust/fume/gas/mist/vapours/spray. 避免吸入粉尘/烟/气体/烟雾/蒸汽/喷雾。
  • P264 Wash hands thoroughly after handling. 处理后要彻底洗净双手。
  • P264+P265
  • P271 Use only outdoors or in a well-ventilated area.? 只能在室外或通风良好的地方使用。
  • P272 Contaminated work clothing should not be allowed out of the workplace. 污染的工作服不得带出工作场所。
  • P280 Wear protective gloves/protective clothing/eye protection/face protection. 戴防护手套/防护服/眼睛的保护物/面部保护物。
  • P301+P330+P331
  • P301+P330+P331+P310
  • P302+P352
  • P302+P361+P354
  • P303+P361+P353
  • P303+P361+P353+P310+P363
  • P304+P340
  • P304+P340+P310
  • P305+P351+P338
  • P305+P351+P338+P310
  • P305+P354+P338
  • P310 Immediately call a POISON CENTER or doctor/physician. 立即呼救解毒中心或医生/医师。
  • P312 Call a POISON CENTER or doctor/physician if you feel unwell. 如果你感觉不适，呼叫解毒中心或医生/医师。
  • P316
  • P317
  • P319
  • P321 Specific treatment (see … on this label). 具体治疗（见本标签上的）。
  • P333+P313
  • P333+P317
  • P362+P364
  • P363 Wash contaminated clothing before reuse. 被污染的衣服洗净后方可重新使用。
  • P403+P233
  • P405 Store locked up. 上锁保管。
  • P501 Dispose of contents/container to..… 处理内容物/容器.....
Signal word
Safety Statements
Risk Statements
UN Number 1760
Packing GroupIII
Hazard Class8
Storage condition 2-8°C, protect from light {LY} 2-8°C, protect from light {} {LY} 2-8°C, protect from light {} {} {LY} 2-8°C, protect from light {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {LY} 2-8°C, protect from light {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {} {}

系列性分类

  1. Chemical Synthesis 化学合成
  2. Organometallic Reagents 金属有机试剂
  3. Organosilicon 有机硅
  4. Trialkoxysilanes - Organosilicon
  1. Materials Science 材料科学
  2. Micro/NanoElectronics - Materials Science
  3. Self Assembly &amp; Contact Printing - Micro/NanoElectronics
  4. Self-Assembly Materials - Self Assembly &amp; Contact Printing
  5. Silanes - Self-Assembly Materials

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